Features
- IGBT MODULE
- Homogeneous SI
- SPT = Soft Punch Through Technology
- VCESAT with positive temperature coefficient
- High Short circuit capability, self limiting to 6 x IC
- Isolated by AI2O3 DCB (Direct Copper Bonded) ceramic plate
- Pressure contact technology for thermal contacts
- Spring contact system to attach driver PCB to the control terminals
- Integrated temperature sensore
Aplications
- Applications
- AC inverter drives
- Uninterruptible Power
- supplies
SKIM400GD128DV1
Specific References
- MPN
- SKIM400GD128DV1